“We continue to invest in capacity and technology to meet the needs of our worldwide customer base,” said CEO Sanjay Jha, pictured. “We are seeing strong demand for our mainstream and advanced technologies [and] these investments will allow us to expand our existing fabs, while growing our presence in China through a partnership in Chengdu.”
The foundry is boosting 14nm FinFET capacity in the US by 20%, with the new capacity due to come online early in 2018. Its New York facility will also continue to develop 7nm process technology and EUV lithography, with 7nm production said to be planned for Q2 2018.
Meanwhile, 22nm FD-SOI capacity – called 22FDX – at Fab 1 in Dresden will be increased by 40% to meet demand for IoT, smartphone processors, automotive electronics and devices for other battery powered applications. The Dresden fab will continue to develop FDX technology, with tape outs of devices targeted at the 12FDXTM process expected to begin in the middle of 2018.
Looking to cater for growing demand in China, Globalfoundries is entering a partnership with the Chengdu municipality to build a 300mm fab. The fab, which will also make 22FDX based products for global customers, will begin production of mainstream process technologies in 2018.
Finally, 40nm capacity at its 300mm fab in Singapore will rise by 35%, with additional 180nm production on 200mm wafers and new capacity for RF-SOI devices.
