IBM, Dow develop photonic interconnects for exascale computing challenges
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Scientists from Dow Corning and IBM have developed a silicone based material that can be integrated into traditional pcbs, but which supports the transmission of light. The development is being targeted at future exascale computers.
Presenting the concept at Photonics West, Dow Corning applications engineer Brandon Swatowski said full waveguide can be built in less than 45 minutes with a high degree of process flexibility.
He claimed that waveguide builds based on the silicone polymer showed excellent adhesion to polyimide substrates and added that losses were as low as 0.03dB/cm.
"Polymer waveguides provide an integrated means to route optical signals similar to how copper lines route electrical signals," said Dr Bert Jan Offrein, manager of the Photonics Research Group at IBM Research. "Our design is highly flexible, resistant to high temperatures and has strong adhesion properties."
Eric Peeters, vice president of Dow Corning Electronic Solutions, noted: "Optical waveguides offer revolutionary new options for transmitting data substantially faster and with lower heat and energy consumption.
"We are confident that silicone based board level interconnects will quickly supersede conventional electronic signal distribution to deliver the amazing speeds needed for tomorrow's supercomputers.
