IBM set to make Micron’s memory cube
Micron's memory cube will be manufactured by IBM at its East Fishkill plant on a 32nm high K metal gate process. By using through silicon via technology, the memory cube is likely to boost bandwidth significantly while reducing power consumption by up to 70%.
According to both companies, memory cube prototypes support bandwidths of 128Gbyte/s yet have a footprint of 10% of the footprint of conventional memory.
IBM Fellow Subu Iyer said: "The manufacturing process we are rolling out will have applications beyond memory, enabling other industry segments as well. In the next few years, 3d chip technology will make its way into consumer products and we can expect to see drastic improvements in battery life and device functionality."
Robert Feurle, Micron's vp of dram marketing, added: "HMC is a game changer, giving architects a flexible memory solution that scales bandwidth while addressing power efficiency. Through collaboration with IBM, Micron will provide the industry's most capable memory offering."
