imec announces industry's first 14nm process development kit

According to imec, it targets the introduction of a number of new key technologies such as FinFET transistors and EUV lithography. imec believes the release will lead the way to an industry standard 14nm pdk and will anticipate the introduction of a number of new 14nm technologies. FinFET transistors, for example, have a larger drive per unit footprint and higher performance at low supply voltages compared to traditional planar technologies. imec says evolutions of the pdk will gradually introduce the use of high mobility channel materials. It includes elements of both immersion and EUV technology, paving the way for a gradual transition from 193nm immersion to EUV technology. This first 14nm pdk is said to contain all elements for design assessment of the 14nm node through device compact models, parasitic extraction, design rules, parameterised cells and basic logic cells. Starting from the pdk, imec and its partners are now designing a first test chip which is planned for the second half of 2012. According to imec, it will allow testing the device, interconnect, process and litho assumptions, as well as performance and power of circuits implemented at the tight area budgets of the 14nm node. The 14nm PDK was developed with imec's partners in its INSITE programme.