'Industy leading' small package for compact sensors
1 min read
Renesas Electronics Europe has announced the development of its IO-Link slave solution equipped with what it describes as 'an industry leading small package'.
The device is suitable for IO-Link slave applications, such as the latest small form factor optical, inductive and capacitive automation sensors.
The IO-Link measures 4 x 7mm and includes Renesas Electronics' All Flash 78K0R 16bit mcu and an ELMOS IO-Link physical layer transceiver. It is equipped with a Ball Grid Array (BGA) package with pin pitch of 0.5mm in which the balls are arranged in two rows around the edge of the chip. This is designed to make it easier to mount the chip on the circuit board.
TMG's IO-Link slave protocol stack software is compliant with the latest IO-Link standard and is available with the new solution.
IO-Link is the new standard serial digital communications protocol used for sensors and actuators in industrial automation systems. Renesas Electronics says that its new single-chip IO-Link slave solution only requires a single chip equipped in a 4 x 7mm package to add IO-Link functionality, enabling system designers to develop significantly smaller sensors that meets the industry demand.
