Manufacturers of industrial machines and equipment ranging from vending machines to remote sensors to asset trackers will now be able to optimise the design of their IoT devices without impacting on either security and quality.
Machine-to-machine communication in the Internet of Things (IoT) requires reliable data collection and uninterrupted data transmission and the ability to use ubiquitous mobile networks, so the ability to deploy eSIM brings a number of advantages enabling a smoother adoption of cellular connectivity into industrial environments.
Device manufacturers can increase their design flexibility due to the eSIM’s small footprint, and simplify manufacturing processes as well as global distribution thanks to a single stock-keeping unit. Customers also have the possibility to change their mobile service provider at any time, for example, if the quality of the network deteriorates or in the event of a better contract from the mobile operator.
The ability to provide a robust quality on a miniature footprint that works even under harshest conditions was a challenge for silicon providers. Infineon’s SLM 97 security controller in a Wafer Level Chip Scale Package (WLCSP) measures only 2.5mm x 2.7mm in size, and supports an extended temperature range of -40 to 105° C.
It has been designed to provide a high-end feature set fully compliant with the latest GSMA specifications for eSIM.
