‘Interesting changes’ found in iPhone 3G S tear down

Beyond faster performance, the iPhone 3G S features video capture, an autofocus 3Megapixel camera and a built in digital compass. Infineon has retained the prime position of baseband chip supplier and TriQuint is still the power amplifier module supplier of choice. Samsung maintained its position as applications processor supplier – the fourth most costly component in the iPhone 3G S after the NAND flash, the display module and the touchscreen assembly. However, the part is now clocked at 600MHz, rather than 400MHz in the 3G. Toshiba has scored the biggest design win in the 3G S, says iSuppli, with its 16Gbyte multilevel NAND flash. One change described as 'noteworthy' is the use of a Broadcom Bluetooth/fm/wlan chip. This is said to represent an ongoing trend of moving to higher levels of integration. Previously, the 3G featured a wlan chip from Marvell and a Bluetooth chip from CSR. Meanwhile, a Dialog Semiconductor power management ic replaces a similar device in the 3G supplied by NXP. The digital compass feature is supported by AKM Semiconductor's electronic compass and STMicroelectronics' accelerometer. The ST part allows the 3G S to determine device orientation or inclination, while the AKM sensor detects device movement relative to magnetic north. "From a component and design perspective," said Rassweiler, "there's a great deal of similarity between the 3G and the 3G S. By leveraging this commonality to optimise materials costs, and taking advantage of price erosion in the electronic component marketplace, Apple can provide a higher performing product with more memory and features at only a slightly higher materials and manufacturing cost."