The integration between Keysight’s Advanced Design System (ADS) and the Siemens Xpedition Enterprise suite of EDA tools will help engineers to more efficiently co-design digital systems and radio frequency (RF) circuits by performing layout and manufacturing in Xpedition and RF Circuit and electromagnetic simulation in Keysight ADS.
With wireless and defence system designs becoming increasingly complex, there is growing integration between RF and the overall system design. Advanced solutions often combine intricate RF components, high-speed digital circuits, and sophisticated signal processing, all of which must work harmoniously.
The collaboration builds on the prior dynamic inter-tool integration from Keysight and Siemens EDA that enabled system design to have bidirectional integration with RF and microwave engineering tools. This initiative integrates complete hierarchical designs bidirectionally between Keysight ADS and Siemens Xpedition Designer and Layout, eliminating the cumbersome and error-prone task of manually translating libraries between the tools.
Engineers can now easily transition between detailed RF design in ADS and system-level design in Xpedition, maintaining integrity across the entire development process. This is crucial for optimising performance in areas including 5G/6G communications, advanced radar systems, and electronic warfare applications, where the interplay between RF and digital domains is critical to system performance.
The new product is included in Keysight Advanced Design System 2025 and Siemens Xpedition Enterprise release 2409.
Commenting Nilesh Kamdar, EDA Design & Verification lead at Keysight, said, “We have a long-established track record collaborating with Siemens to support customers in enabling the next generation of wireless design. The bidirectional integration allows engineers to optimise performance across various applications, including 5G/6G and radar systems.”
“As engineering teams strive to achieve digital transformation, the digital thread between RF and electronic system design becomes more critical,” added AJ Incorvaia, Senior Vice President, Electronic Board Systems, Siemens Digital Industries Software. “We’re pleased to announce improved integration enabling concurrent design to optimise system performance and improve quality while accelerating design closure.”
