Supported in capacities of 256 gigabytes (GB), 512GB, and 1 terabyte (TB), these new products are intended for a variety of next-generation mobile applications, including leading-edge smartphones.
The enhanced performance of the new UFS products is intended to optimise 5G connectivity, enabling accelerated downloads, minimised latency, and an enhanced user experience.
A smaller package size enables improved board space efficiency and greater design flexibility.
Key features include:
- Read / write speed improvement over previous generation: approx. +15% sequential write, +50% random write and +30% random read.
- Package size reduction over previous generation: Package size is 9mmx13mm and package thickness is 0.8mm (256GB and 512GB) and 0.9mm (1TB), resulting in an approx. 18% reduction compared to conventional package size (11mmx13mm).
KIOXIA was the first company to introduce UFS technology and has continued to develop new products.
These latest UFS Ver. 4.0 devices integrate the company’s BiCS FLASH 3D flash memory and a controller in a JEDEC standard package.
UFS 4.0 incorporates MIPI M-PHY 5.0 and UniPro 2.0 and supports theoretical interface speeds of up to 23.2 gigabits per second (Gbps) per lane or 46.4 Gbps per device. UFS 4.0 is also backward compatible with UFS 3.1.
"KIOXIA’s UFS technology is the 'racehorse equivalent' of the company's family of embedded storage devices. With our next-generation UFS 4.0, we have doubled the random write and increased random reads by 30%," said Axel Störmann, Vice President and Chief Technology Officer for Embedded Memory and SSD, KIOXIA Europe.
Sample shipments for the 256 and 512GB products begin later this month, with the 1TB offering following in June 2024.
