The 28nm process is the most advanced process used for manufacturing OLED DDICs currently available and the OLED DDIC from Magna Chip has achieved a form factor reduction that is 20 percent smaller than that of the previous 40nm process and is suitable for smartphones and other mobile devices, where small size and thinness are critical factors.
In addition, MagnaChip has reduced the logic voltage from 1.1V, which was required for the existing 40nm products, to 1.0V, which reduces the current voltage consumption by more than 20 percent and also extends battery life.
With the addition of this new 28nm platform OLED DDIC, MagnaChip now has a portfolio of nine advanced platform OLED Display Driver ICs, including one 110nm rigid bezel-less, two 55nm flexible bezel-less and five 40nm rigid bezel-less OLED DDICs.
MagnaChip’s product roadmap includes plans to expand the feature set of OLED DDICs to include Ultra-High-Definition (UHD) capabilities.
The 28nm OLED display driver IC is expected to improve the call quality of smartphones by reducing EMI (Electromagnetic Interference) levels by 20 percent, as compared to existing products based on the 40nm format. The 28nm new OLED driver IC supports various display types such as rigid, flexible, foldable and VR, AR applications. It also maximizes design flexibility for latest full-screen displays, such as bezel-less, hole type displays.
This new display driver already has won its first design-in at a leading smartphone manufacturer.
Commenting YJ Kim CEO of MagnaChip said: “By launching the 28nm OLED DDIC, we expect it will help mobile device manufacturers develop new generations of smaller and more energy-efficient products with crisp displays. Further, MagnaChip plans to extend its DDIC portfolio from current OLED smartphones to the rapidly growing OLED TV, OLED automotive and MicroLED TV applications, as well as foldable smartphones.”
