Now able to offer much greater performance and cost efficiencies, MICLEDI’s solution will be able to address the needs of future AR glasses in terms of the display size, resolution, brightness, image quality, power consumption and cost.
Technology attributes include:
- CMOS-fab compatible, RGB epitaxial materials reconstituted on 300mm CMOS wafers, co-integrated with advanced node CMOS backplane ASICs via W2W hybrid bonding.
- Pixel-level Fresnel lens beam shaping for high-efficiency waveguide integration.
- MicroLED technology tailored for industry-standard tooling and process steps available for volume manufacturing at CMOS foundries.
MICLEDI is a spin-off of IMEC, the research and innovation hub in nano-electronics and digital technologies. The company was able to leverage IMEC’s extensive background in 3D integration technologies and had access to 300mm CMOS pilot-line infrastructure for the development and prototyping.
AR headsets are currently heavy and bulky, image realism is poor, resolution is low, and headsets are costly.
According to industry analyst firm Yole Development, the demand for microdisplays in AR headsets is projected to grow at CAGR >100%, rising to more than $1.8bn in 2025 and more than $4.9bn in 2027.
Commenting Sean Lord, CEO of MICLEDI, said,“AR headsets today can be found in industrial and medical niche markets. We intend to change that by enabling AR glasses that are stylish, compact, lightweight, with long battery life, and images that look just like reality. The Holy Grail in AR glasses. Our 300mm manufacturing flow is the technology needed to overcome the challenges with first- and second-generation AR glasses and is necessary to achieve the features consumers will require for the ultimate visually immersive AR experience.”
