The triple level cell (TLC) NAND device, built on Micron's 16nm process, is said to deliver features which suit applications like USB drives and consumer solid state drives.
"Our new TLC NAND technology meets rising demand for reliable high capacity storage," said Kevin Kilbuck, director of NAND planning. "We see 16nm TLC as an excellent solution for 2015 consumer applications as we drive toward 3D NAND TLC production in 2016."