New wafer split service launched by ams
Those looking for a more cost effective prototyping system could be interested in the Multi-Project Wafer (MPW) service from ams. The 2014 schedule has been announced and includes dates for a range of 0.18 and 0.35µm services.
The company is offering four MPW runs in its 0.18µm cmos (C18) process, as well as four MPW runs in its advanced 0.18µm high voltage cmos (H18) technology. The H18 process technology is based on IBM's industry proven 0.18µm cmos process CMOS7RF and offers industry first rf integration and high density SoC capability.
According to ams, there will be 14 runs in 2014 of the 0.35µm specialty processes, which are based on the 0.35µm cmos process transferred from TSMC.
These include the 0.35µm high voltage cmos process family with a 20V cmos option, suited for power management products and display drivers; a 50V cmos option, optimised for automotive and industrial applications; and a 120V module, which meets the requirements of sensor and sensor interface chips in high voltage applications.
