Nintendo Wii U system powered by IBM technology

The console will be powered by an IBM custom designed microprocessor, while its embedded DRAM will be used to feed the multicore processor vast amounts of data. This, says IBM, will enable smooth graphics and play. The chips will be manufactured at its 300mm semiconductor manufacturing facility in East Fishkill, New York (pictured) and will feature IBM's silicon on insulator technology at 45nm. IBM previously collaborated with Nintendo by designing and manufacturing the central microprocessor for the GameCube system in 1999. Since then, it has shipped more than 90million chips for Wii consoles. "We're very proud to have delivered to Nintendo consistent technology advancements for three generations of entertainment consoles," said Elmer Corbin, director, IBM's custom chip business. "Our relationship with Nintendo underscores our unique position in the industry - how we work together with clients to help them leverage IBM technology, intellectual property and research to drive innovation into their own core products." Nintendo unveiled the Wii U system today at E3 Expo, Los Angeles. The device includes a controller with a 6.2in screen, providing what Nintendo describes as 'a multitude of new video game experiences'.