The company has confirmed that it will be using grants provided via the 2nd Important Project of Common European Interest on Microelectronics and Communication Technologies (IPCEI ME/CT), with the final investment decision pending confirmation of the level of public funding.
NXP teams across Austria, Germany, the Netherlands and Romania will look to innovate in core technologies across automotive, industrial and cybersecurity. This includes 5nm, advanced driving assistance and battery management systems in automotive, 6G and Ultra-Wideband as well as artificial intelligence (AI), RISC-V and post-quantum cryptography.
“NXP’s planned investments in our Austrian, German, Dutch, and Romanian operations signal our strong commitment to the EU’s goal of enabling both digital and green transition,” said Kurt Sievers, President and CEO of NXP. “Our activities through IPCEI ME/CT complement NXP’s planned joint venture participation in TSMC’s first European foundry. It also underscores our commitment to strengthening innovation and supply chain resilience in Europe. NXP believes expanding research, development, and manufacturing efforts in Europe is of vital importance, and each of these three critical elements must be successfully integrated to achieve greater European semiconductor ecosystem resilience.”
Extensive research, development, and manufacturing presence across multiple sites in all four countries will enable NXP to develop cutting-edge technology and products that contribute significantly to the achievement of EU industrial strategies.
In close collaboration with a strong ecosystem of more than 50 partners from industry and academia across Europe, NXP will strengthen key technologies of microelectronics in Europe.
NXP is also an active participant in three of the four IPCEI ME/CT workstreams: “Sense”, “Think”, and “Communicate”, reflecting NXP’s areas of technical leadership and strategic focus.
NXP’s planned investments in Austria, Germany, the Netherlands, and Romania follow the announcement that the company is going to form a new joint venture, ESMC (European Semiconductor Manufacturing Company), with TSMC, Bosch, and Infineon with plans to establish TSMC’s first semiconductor manufacturing site in Europe.
The 300mm fab, planned to be built in Dresden, Germany, is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC’s 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology, further strengthening Europe’s semiconductor manufacturing ecosystem with advanced FinFET transistor technology and creating about 2,000 direct high-tech professional jobs.
