The company has also created a new Machine Vision Unit, which will focus on creating solutions for industrial automation, robotics, logistics barcode scanners and intelligent transportation systems (ITS).
These new GS sensors feature 2.2-micron (µm) backside-illuminated (BSI) pixels delivering high resolution in a compact design. The high-resolution, small-format GS sensors provide the highest shutter efficiency available on the market, according to OMNIVISION, with the ability to capture high-speed moving objects clearly and accurately at high frame rates.
These sensors also feature high sensitivity, low noise and enhanced NIR quantum efficiency (QE) for low-light performance.
Compared to the previous-generation 2.5µm frontside-illuminated (FSI) GS sensors, the 2.2µm BSI GS sensors can achieve 1.08x sensitivity with an F2.0 lens and 2.16x sensitivity with an F1.4 lens. The OG05B1B is a 5-megapixel (MP) resolution CMOS monochrome GS sensor in a 1/2.53-inch optical format (OF), while the new OG01H1B is a 1.5MP resolution CMOS monochrome GS sensor in a 1/4.51-inch OF.
“We see a huge demand in the machine vision market for 3D cameras and CMOS image sensors,” said Michael Wu, senior vice president, global sales and marketing, OMNIVISION. “Our new Machine Vision Unit will focus on understanding our customers’ needs and product roadmaps and address them with novel vision solutions.”
Both image sensors feature OMNIVISION’s Nyxel near-infrared (NIR) technology, which boosts QE to 700-1050nm, enabling the capture of brighter images from farther away; PureCel Plus-S stacked-die architecture for best-in-class image sensor performance; and CSP package technology for the smallest possible dimensions.
The GS sensors are available for sampling now and will be in mass production this quarter.
