OptoCplrLT has been designed to overcome fibre-to-SiPh photonic integrated circuit (PIC) coupling challenges to enable high volume automated assembly and help drive down costs.
Created using Optoscribe’s proprietary high-speed laser writing technique, OptoCplrLT features low-loss light turning curved mirrors, which have been uniquely formed in the glass, to direct the light to or from SiPh grating couplers. This prevents the need for bend-tolerant fibre solutions, which are often expensive, challenging and have some significant limitations in size and profile.
To help address footprint challenges, OptoCplrLT has been designed with a low-profile interface of less than 1.5mm in height, which allows compact interface layouts that alleviate packaging constraints. It is also compatible with industry-standard materials and processes; for example, the glass chip has a coefficient of thermal expansion matched to the silicon chip, helping to maximise performance.
Russell Childs, CEO of Optoscribe, said: “With data centre operators and transceiver manufacturers seeking innovative solutions to help address fibre-to-SiPh PIC coupling challenges, we are pleased to introduce OptoCplrLT to help meet market demands of performance, cost and volume, as well as helping to overcome such hurdles including SiPh transceiver packaging and integration.”
