This collaboration is intended to accelerate the development of cutting-edge RF power amplifiers for 5G and 6G infrastructure, a critical component in next-generation wireless communication systems.
SimplyRFMW, which is based in Cardiff, was founded by academics and industry experts in RF and microwave engineering and was set up to advance solutions in this specialised field. The company has a reputation for leveraging its deep expertise to design next-generation components critical to wireless communications and other RF applications.
Polymatech Electronics, based in Chennai, is India's first semiconductor chip manufacturer that specialises in the PC-centric to the new data-centric world and is expanding its product offerings to provide end-to-end solutions, scaling from edge computing to 6G network, cloud, and the emerging fields of AI and autonomous driving.
This proposed partnership will initially focus on the research and development of integrated RF components using international semiconductor foundries, after which they will be processed commercially in the company’s California Unit - Nisene Technology Group and Polymatech's advanced packaging capabilities.
Key areas of collaboration include designing low-phase-noise RF amplifiers for 5G and 6G infrastructure and exploring the application of Gallium Nitride (GaN) technology in extreme environments, such as space and defence systems.
"SIMPLYRFMW has undertaken the task of developing integrated components for future 5G and 6G infrastructure, using international semiconductor foundries and Polymatech's expertise in advanced electronics packaging. We are currently prioritising the preliminary stages of research and development with a strict focus on 5G and 6G applications," said Dr. Chaudhry, Sr Scientist at SimplyRFMW.
"Through this proposed collaboration, we seek to purposefully utilise RF power amplifier design capabilities to enhance the product portfolio of Polymatech Electronics. In doing so, we will help establish relationships between Polymatech and South Wales universities and institutions,” said Dr. Quaglia, Scientist, SimplyRFMW.
Vishaal Nandam, Executive Director of Polymatech Electronics, added, "With the integration of RF technology, Polymatech is taking a pioneering step toward advancing GaN-based dies and HTCC substrates for geostationary satellites.
“GaN's robustness is already proven in our products, and now, we are targeting its application in space environments. By addressing the challenges of space radiation, we aim to enhance satellite reliability and open new avenues for both scientific exploration and commercial satellite communication."
This partnership marks a significant milestone for both companies who are aiming to deliver next-generation solutions that will redefine the landscape of global connectivity and drive further innovation in telecommunications and defence technologies.
