The device has been optimised for amplifying signals from sensors such as temperature, pressure, flow rate, used in smartphones, small IoT devices, and similar applications.
With the size of smartphones and IoT devices continuing to decrease - requiring smaller components - there is a need to accurately amplify small signals in high precision sensing, so op amps must be able to improve low input offset voltage and noise performance while continuing to shrink the form factor.
With the TLR377GYZ, ROHM has succeeded in balancing miniaturisation with high accuracy (which has been difficult to achieve with conventional op amps) by further evolving proprietary circuit design, process, and packaging technologies developed over a number of years.
Op amps’ input offset voltage and noise generation degrade amplification accuracy and can be suppressed by increasing the size of the built-in transistors - but at the expense of miniaturisation.
Consequently, ROHM has developed proprietary circuits which achieve a maximum offset voltage as low as 1mV without increasing the size of the transistors. In addition, proprietary process technology greatly reduces flicker noise, while ultra-low noise is achieved with a low input equivalent noise voltage density which has been achieved by optimising the resistive components at the element level.
Furthermore, the new product adopts a WLCSP (Wafer Level Chip Scale Package) with a ball pitch of just 0.3mm utilising original packaging technology. This reduces size by approximately 69% compared to conventional products and 46% over existing compact products.
The IC-mounted conversion board that can replace SSOP6 packages is also offered to support replacement considerations and initial evaluation. Both the new product and conversion board are available for purchase through online distributors.
In addition, the high accuracy SPICE model – called ROHM Real Model – is available on ROHM’s website for verification simulations.
