The new MGM210x and BGM210x Series 2 modules support Zigbee, Thread and Bluetooth mesh, Bluetooth Low Energy and multiprotocol connectivity and improve mesh network performance for line-powered IoT systems ranging from smart LED lighting to home and industrial automation.
Pre-certified, the xGM210x modules help reduce R&D cycles related to RF design and protocol optimization, allowing developers to focus on their end applications. Pre-certified for North America, Europe, Korea and Japan, the modules cut the time, cost and risk factors related to global wireless certifications.
The modules are based on Silicon Labs’ Wireless Gecko Series 2 platform featuring RF performance, a powerful Arm Cortex-M33 processor, software stacks, a dedicated security core and a +1250C temperature rating suited for harsh environmental conditions. The modules are engineered to optimise the performance of resource-constrained IoT products without requiring functionality trade-offs that could impact communication reliability, product security or field upgradability. An integrated RF power amplifier also makes the modules suitable for long-range Bluetooth Low Energy applications requiring hundreds of meters of line-of-sight connectivity.
“This portfolio of application-optimised modules provides a fast and easy wireless on-ramp to mesh networking, helping IoT developers get their connected products to market ahead of the competition while preserving their investments in tools and software,” said Matt Saunders, Vice President of Marketing and Applications, IoT Products, Silicon Labs. “Our fully integrated module design, comprehensive wireless stacks, state-of-the-art security and powerful development tools help our customers add wireless connectivity and mesh capabilities to IoT applications with the lowest R&D investment, saving months of engineering effort and testing.”
The Series 2 module portfolio’s initial families include the industry’s first pre-certified wireless modules optimised for LED light bulbs and a versatile printed-circuit board (PCB) form-factor module designed to meet the needs of a broad range of ultra-small IoT product designs.
The modules combine a custom form factor to ease mounting inside LED bulb housings, PCB trace antenna to maximise wireless range, high temperature ratings, extensive global regulatory certifications and low active power consumption, delivering the perfect wireless solution for cost-sensitive, high-volume smart LED lightbulbs.
xGM210P modules feature a PCB form factor, integrated chip antenna and minimal clearance areas for mechanics, simplifying space-constrained IoT designs including smart lighting, HVAC, building and factory automation systems.
xGM210x modules enable developers to implement robust security in IoT products. Secure boot with root of trust and secure loader (RTSL) technology helps prevent malware injection and rollback to ensure authentic firmware execution and over-the-air (OTA) updates. A dedicated security core isolates the application processor and delivers fast, energy-efficient cryptographic operations with differential power analysis (DPA) countermeasures. A true random number generator (TRNG) compliant with NIST SP800-90 and AIS-31 strengthens device cryptography. A secure debug interface with lock/unlock allows authenticated access for enhanced failure analysis. The module’s Arm Cortex-M33 core integrates TrustZone technology, enabling system-wide hardware isolation for trusted software architectures.
Developers can also further accelerate time-to-market by taking advantage of Silicon Labs’ Simplicity Studio integrated development environment featuring comprehensive software stacks, application demos and mobile apps. Advanced software tools including a patented network analyser and energy profiler help developers optimize the wireless performance and energy consumption of IoT applications.
