TEL Joins Sematech to develop resists for EUVL processing
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Tokyo Electron Limited (TEL) has joined Sematech's Lithography Program in a bid to develop cost effective lithography for member companies and the semiconductor industry.
The TEL team will work alongside Sematech engineers at CNSE's Albany NanoTech Complex (pictured) to advance extreme ultraviolet lithography (EUVL) and related infrastructure - including mask defect reduction, mask metrology, source, resist processing, etch, and overall manufacturability and extensibility of the technology.
Masayuki Tomoyasu, senior vice president of TEL Technology Centre, America believes that the move will position the two companies to lead the industry in enabling pilot line ready resist processing.
Tomoyasu said: "We are excited by this opportunity to join TEL's engineering expertise with Sematech's research and development capabilities and know how to develop leading edge EUV lithography capability for our semiconductor customers. We look forward to working with Sematech to meet the technical and economic requirements of EUV technology and move the industry forward."
Richard Brilla, vice president for strategy, alliances and consortia at CNSE, added: "We are delighted to welcome this new alliance between Sematech and TEL, both of which are among the global technology leaders engaged in next generation nanoelectronics research and development at the Albany NanoCollege. This new collaboration will enable advanced research for EUV lithography to support the critical needs of industry, while further demonstrating the success of the Sematech-CNSE partnership in accelerating leading edge technologies."
