The new fab will be located next to the company’s existing 300-mm fab in Lehi, LFAB. Once completed, both will be operated as a single fab.
“This new fab is part of our long-term, 300-mm manufacturing roadmap to build the capacity our customers will need for decades to come,” said Haviv Ilan, TI executive vice president and chief operating officer, and incoming president and chief executive officer. “Our decision to build a second fab in Lehi underscores our commitment to Utah and is a testament to the talented team there who will lay the groundwork for another important chapter in TI’s future.
“With the anticipated growth of semiconductors in electronics, particularly in industrial and automotive, and the passage of the CHIPS and Science Act, there is no better time to further invest in our internal manufacturing capacity.”
The landmark $11 billion investment will create approximately 800 additional TI jobs as well as thousands of indirect jobs and TI said that it was looking to strengthen its partnership with the Alpine School District and will invest $9 million to improve student opportunities and outcomes.
Commenting on the announcement the Utah Gov., Spencer Cox, said, “TI’s new semiconductor fab will solidify Utah as a global semiconductor manufacturing hub for generations to come.”
Lehi provides TI was access to skilled talent, existing infrastructure and a strong network of community partners. The new fab will manufacture tens of millions of analogue and embedded processing chips daily.
The new facility will be designed to meet one of the Leadership in Energy and Environmental Design (LEED) building rating system’s highest levels of structural efficiency and sustainability: LEED Gold. Plans include recycling water at nearly double the rate of the existing Lehi fab. TI said that advanced 300-mm equipment and processes would further help to reduce waste, water and energy consumption per chip.
Construction is expected to begin in the second half of 2023, with production as early as 2026. TI is also building four new 300-mm wafer fabs in Sherman, Texas.
