Thinned chips to secure paper
A team at North Dakota State University has developed a way to embed RFID chips within paper that is said to be quicker, cheaper and to offer wider application than current methods.
Apart from the creation of more secure banknotes, the process – called Laser Enabled Advanced Packaging (LEAP) – could also be used in legal documents, tickets and smart labels.
The process uses lasers to transfer and assemble the chips on paper. Chips are initially thinned using a plasma etcher, after which a laser is used to embed the thin chips and an antenna.
According to Professor Val Marinov: "I believe our scheme is the first to demonstrate a functional RFID tag embedded in paper."
