X-FAB ships billionth MEMS device, completes noble metal facility
X-FAB has shipped its billionth MEMS device – a milestone which coincides with the completion of the company's dedicated noble metal facility for MEMS and post cmos processing.
Built specifically for the processing of MEMS, the new facility extends X-FAB's site in Erfurt, Germany, by adding gold deposition and patterning capability. Targeting the expanding consumer, mobile and computer markets, the facility can reportedly handle approximately 100,000 wafers a year.
Iain Rutherford, business line manager for X-FAB's MEMS foundry service, commented: "Since 1995 we have manufactured and shipped a billion MEMS devices, including gyroscopes, accelerometers, pressure sensors, thermopiles and microfluidic devices, as well as cmos integrated MEMS sensors and wafer level packaged devices for consumer, automotive and medical applications. The addition of the new MEMS facility reflects our passion to fully support our customers with MEMS, sensors and analogue/mixed signal technology foundry services."
