Xilinx and TSMC ship first heterogeneous 3d ics
Claiming an industry first, Xilinx and TSMC have commenced volume production of the Virtex-7 HT family of heterogeneous 3d ics.
The all programmable, 28nm devices were developed using TSMC's Chip on Wafer on Substrate (CoWoS) 3d ic process.
Featuring up to 16 28Gb/s and 72 13.1Gb/s transceivers, Xilinx is aiming them at the next generation of wired communications, high performance computing, medical image processing and asic prototyping and emulation applications.
Victor Peng, senior vp of products for Xilinx, commented: "Collaborating with TSMC to successfully reach CoWoS volume production cements Xilinx's position as both a pioneer and industry leader in 3d ic technology and products.
"Working together, we have honed the procedures and technologies to produce the next generation of groundbreaking, CoWoS based 3d ics, and are now positioned to leverage TSMC's 20SoC and 16nm FinFET process with our UltraScale architecture to further our industry lead."
