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News
Applications for Subcon’s Launchpad start-up zone extended to 8th August
27 Jul 2021
Board Level Design
MIKROE introduces LTE IoT 8 Click board
27 Jul 2021
Automotive
CAST and Avery Design Systems expand IP partnership
27 Jul 2021
£53 million digital technology funding boost for UK manufacturers
27 Jul 2021
Memory
Nexperia looks to enable large logic functions in small form factor systems
27 Jul 2021
Embedded Systems
ST manufactures first 200mm silicon carbide wafers
27 Jul 2021
Embedded & Programmable
GOWIN Semiconductor announces ISP IP core and solution
26 Jul 2021
Board Level Design
Bulgin launches connector/cabling configuration tool
26 Jul 2021
Communications Hardware
Easier user interface design of IoT applications
26 Jul 2021
Memory
CrossBar announces ReRAM Based PUF Keys
26 Jul 2021
Research Design
Funding for next generation diamond-enabled technologies
26 Jul 2021
CPUs
ST extends support for ML in STM32Cube.AI ecosystem
26 Jul 2021
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