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News
Distribution
Farnell signs global distribution agreement with Seeed Studio
03 Jul 2023
Audio Technology
Dolphin Design unveils IP for sound classification cutting down energy by 99%
03 Jul 2023
Electronics
MIKROE’s IrDA 4 Click provides solution for sending and receiving IR serial data
03 Jul 2023
Distribution
Harwin enters into distribution agreement with TME
03 Jul 2023
Automotive
Vector now supports automotive ethernet interfaces for 10BASE-T1S
03 Jul 2023
Electronics
Lightelligence unveils first optical network-on-chip processor
29 Jun 2023
Automotive
Seoul Robotics introduces QuickConnect
29 Jun 2023
Memory
Weebit Nano’s ReRAM IP fully qualified in SkyWater Technology’s S130 process
29 Jun 2023
Electronics
Imec and ASML sign agreement to support chip research and sustainable innovation
29 Jun 2023
EDA & Design Software
Synopsys and Samsung Foundry accelerate multi-die system design
29 Jun 2023
Wireless Technology
CEVA introduces Channel Sounding over Bluetooth enabling accurate positioning
29 Jun 2023
EDA & Design Software
Cadence expands Samsung Foundry collaboration
28 Jun 2023
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