Engineering publications brought to you by Mark Allen

Product Launches

Interconnection

L-com introduces rugged SJTOW power cords

RF & Microwave

Fairview Microwave expands analogue and TTL programmable voltage-controlled phase shifters

Interconnection

New PCB connectors open up design freedom

Embedded Systems

QS93 SoM delivers miniaturisation, high thermal efficiency and low EMI

5G

One-piece 2nd generation GDBC connectors for complex stack ups in 5G systems

Power

Nexperia expands portfolio offering precise power control with extra system safety

Displays

7-Inch Touch Panel PC with 800:1 contrast ratio

Embedded Systems

ADLINK’s COM-HPC module offers i9, 24 cores, and 36MB cache at 65W TDP

RF & Microwave

Wi-Fi 6E components handle frequencies up to 12 GHz

Interconnection

Cinch Connectivity Solutions unveils mmWave Angled 30-degree product family

Power

Infineon adds to OptiMOS 5 portfolio targeting high power ECUs

Board Level Design

THERM-A-GAP GEL 50TBL, a dispensable thermal gel for thin bond line applications