Engineering publications brought to you by Mark Allen

Product Launches

Interconnection

Binder unveils angled variants of the 720/770 series

Power

Toshiba photorelays feature maximum turn on time of only 0.25ms

Power

Halo Microelectronics introduces dual-phase 30W pump charger

Power

TDK unveils programmable 5kW power supplies for EV and battery testing

Power

Next generation 1200 V CoolSiC Trench MOSFET

System Design

Microchip unveils 5071B caesium atomic clock

Electromechanical

‘Go-Anywhere’ MINI-DATA-BOX plastic enclosures now customisable

Board Level Design

Parker releases high-flow thermal gel for high-volume applications

Communications Hardware

mm Waveguide ‘Horn’ antennas cover broad frequency range

Interconnection

Wire connecting solution replaces manual splicing in harsh environments

Embedded Systems

Industrial motherboard supports extensive graphics performance

Interconnection

New board-to-board connector technology launched