Adapter adds FeaturePak I/O module sockets to SUMIT-ISM stacks
1 min read
Diamond Systems a supplier of ruggedised single board computers (SBCs) and I/O expansion modules has unveiled an adapter board that allows the use of FeaturePak I/O expansion modules in systems that provide SUMIT-ISM expansion stack locations.
The FeaturePak socket on the SUMIT/FP adapter consumes a single PCI Express x1 lane from the SUMIT-A bus connector on the SUMIT-ISM module. The adapter provides a pair of 50pin I/O header connectors for convenient access to all FeaturePak I/O. In addition, it includes pass through connectors for the SUMIT-ISM stack's SUMIT-B bus and PC/104 (ISA) bus. An extended operation temperature range of -40 to 85oC is supported.
The FeaturePak specification defines tiny, application-oriented personality modules – three-fifths the size of a credit card – that snap into sockets on SBCs, COM baseboards, and full-custom electronic circuit boards.
FeaturePak modules interface to the host system via a single 230pin connector, which carries PCI Express, USB, I2C, and several other host-interface signals, plus up to 100 points of application I/O per module.
The FeaturePak host interface is CPU agnostic and is compatible with both Intel- and RISC-architecture systems. Additionally, the modules can easily be integrated into embedded designs along with Qseven, COM Express, Mobile-ITX, SUMIT, PCI/104-Express, EBX, and EPIC.
