Targeting set top boxes, flat panel displays, cable modems, broadband routers, Voice-over-IP (VoIP) equipment and Gigabit Passive Optical Network (GPON) communication infrastructure, LPH00xx series heatsinks are offered in form factors that cover 10 x 10 x 2mm through to 40 x 40 x 5mm.
VersarienCu has a multitude of interconnected pores distributed homogeneously throughout its base copper material. A thin but hard high temperature copper oxide coating is then deposited on to it. The result is a reduction in height without compromising its capacity to remove heat generated by the electronics it is in contact with.
Versarien claims that LPH00xx heatsinks can outperform comparable solutions by up to 6°C/W. For an applied load of 5W the thermal resistance of a LPH0010 (40mm x 40mm x 5mm) heatsink is 17.4°C/W, while for a 2W load the thermal resistance of the LPH0004 (20mm x 20mm x 5mm) product is 35.8°C/W.
