The AgileSwitch power module kit speeds development from evaluation through production, eliminating the need to procure power modules and gate drivers separately – including gate drivers that are qualified for end-product production. Using Microchip’s gate drivers and proven, high-performance SiC power modules, developers will be able to avoid qualifying power modules and spending time to develop their own gate drivers, which can save months in development schedules.
Microchip’s portfolio of 700, 1200 and 1700V SiC Schottky Barrier Diode (SBD)-based power modules utilises its newest generation of SiC die. In addition, its dsPIC Digital Signal Controllers deliver performance, low power consumption and flexible peripherals. The AgileSwitch family of digital programmable gate drivers fare intended to accelerate the process of moving from the design stage to production.
Microchip’s combination of SiC power module and software-configurable gate driver features Augmented Switching technology that enables designers to influence dynamic issues including voltage overshoot, switching losses and electromagnetic interference.
Using a Windows-based computer interface, this “configure-at-a-click” method may be used throughout the design process, from expediting early evaluation to simplifying final optimisation using a computer mouse instead of a soldering iron.
Microchip’s AgileSwitch kit provides design engineers with a central point of contact for support, and ensures that the die, power package and gate driver are designed specifically for each other – eliminating potential development delays.
The kit includes the AgileSwitch Intelligent Configuration Tool that optimises gate turn-on and turn-off, short circuit response and module efficiency while reducing voltage overshoot, ringing and electromagnetic interference.
