Infineon Technologies is looking to support these trends with the introduction of the Thin-TOLL 8x8 and TOLT packages that enable the maximum usage of the PCB mainboard and daughter cards, while also taking the system’s thermal requirements and space restrictions into account.
The company is expanding its line of CoolSiC MOSFET discretes 650 V with two new product families housed in the Thin-TOLL 8x8 and TOLT packages.
These families are based on the CoolSiC Generation 2 (G2) technology, offering significantly improved figures-of-merit, reliability, and ease-of-use. Both product families specifically target high and medium switching-mode power supplies (SMPS), including AI servers, renewable energy, EV chargers, and large home appliances.
The Thin-TOLL package has a form factor of 8x8 mm and offers the best-in-class Thermal Cycling on Board (TCoB) capability on the market. The TOLT package is a top-side cooled (TSC) enclosure with a similar form factor to TOLL.
Both package types offer developers several benefits: Using them in AI and server power supply units (PSU), for example, reduces the thickness and length of the daughter cards and allows for a flat heat sink.
When used in microinverters, 5G PSU, TV PSU and SMPS, the Thin-TOLL 8x8 package allows for a minimisation of the PCB area occupied by the power supply devices on the mainboard, while TOLT keeps the junction temperature of the devices under control, given that these applications typically use convection cooling.
In addition, TOLT devices complete Infineon's top-side cooled CoolSiC industrial portfolio, namely CoolSiC 750 V in Q-DPAK. They enable developers to reduce the PCB footprint occupied by SiC MOSFETs when the power to be delivered to the devices does not require a Q-DPAK package.
The CoolSiC MOSFETs 650 V G2 in ThinTOLL 8x8 and TOLT are now available in R DS(on) from 20, 40, 50 and 60 mΩ. Additionally, the TOLT variant is also available with an R DS(on) of 15 mΩ.
The product family will be expanded by a more granular portfolio by the end of 2024.
