Devices offer ‘leading’ power density for dc/dc synchronous buck applications

The 25V devices feature the company's latest generation silicon in a novel package that is said to deliver benchmark power density in a 5 x 6mm PQFN. An integrated monolithic FETKY enables efficient dissipation of the heat from the source of the synchronous mosfet directly to the ground layers of the pcb, resulting in improved thermal performance. As a result, IR says one of the new devices may replace two 5 x 6mm standard single devices. Designers also have the option of using 25V mosfets in place of less efficient 30V devices. Target applications include advanced telecom and netcom equipment, servers, graphic cards, desktop, Ultrabook and notebook computers.