Using these parts, the company claims, will allow those designing power systems to take advantage of better switching speeds and to create smaller products.Supplied in passivated die packages measuring 0.9 x 0.9mm, the devices are said to be suited to such applications as high speed DC/DC conversion, wireless power transfer, high frequency hard and soft switching circuits, and lidar/pulsed power systems.
The company has also launched development boards to support product evaluation.The boards, which measure 2 x 1.5in, are in a half-bridge topology and contain all the critical components.