The 1.27mm pitch EMM interconnects effect a 40% space reduction over their parent CMM series and a 20% space saving when compared to standard Micro D connectors.
On a 1.27mm pitch in 04 to 60 pin configurations, the EMM Series is highly modular, suited to both board to board (thanks to their secure wiping length) and board to wire (from gauge 24 to gauge 30) configurations, with male and female thru-hole and SMT straight and 90° variants as well as cabled versions available.
90° EMM Series interconnects feature integrated back protection, with the contacts protected by a proprietary design. Hardware is interchangeable, with locking and guiding functions available on both
EMM Series connectors have high-performance glass fibre composite moulding, copper alloy male pins and female pins featuring tulip technology – a clip with a 4-finger spring contact made with the outer in copper alloy and beryllium copper inner. Fixing hardware is passivated 300-series stainless steel. EMM interconnects can be mated and unmated up to 500 times.
Electrical performance: rated voltage is 250V RMS at sea level, dielectric withstanding voltage 750V RMS. At high altitude, diaelectric withstanding voltage is 540V RMS at 30,000 feet and 465V RMS at over 100,000 feet.
For extreme environments, the EMM Series is qualified to withstand vibration, shock, extreme temperature cycling, fluid immersion, humidity and salt spray corrosion. For space applications, they are certified to meet the ASTM E595 (ECSS-Q-ST-70-02C) specification for thermal vacuum outgassing.
