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18 Nov 2015

FTDI Chip strengthens X-Chip USB platform with range of breakout boards

FTDI Chip has introduced an array of breakout boards, adding to the support it can offer engineers using its X-Chip series. These compact, low-profile items, bridge USB 2.0 signals to serial or parallel interfaces.

The UMFT200XD is a USB-to-I²C module with four control bus lines, which is based on the FT200XD device. The UMFT201XB incorporates an FT201XQ IC and is also designed for USB-to-I²C conversion. This is complemented by the UMFT220XB, featuring a FT220XQ, which enables conversion of USB to a parallel bit interface where the data bus may be set to a bit width of one, two, four or eight depending on design constraints. The UMFT230XB module relies on a FT230XQ USB-to-UART IC. It has four control bus lines and can be utilised for UART bridging with a UART rate of 3Mbit/s.

The X-Chip breakout boards will also be offered in two other versions: The -NC variant is supplied without the connector on the I/O side, while the -WE variant comes with 15cm ‘flying leads’ attached.