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H-bridge drivers offer real-time current monitoring and versatile control for brushed DC motors

Toshiba Electronics Europe has launched two single-channel H-bridge drivers for brushed DC motors.

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These drivers, the TB67H453FNG and TB67H453FTG, feature maximum motor output ratings of 50V and 3.5A, ensuring they can handle a wide range of DC motor driving applications. They combine robust performance with advanced features that optimise efficiency and broaden application possibilities.

Central to these drivers is a built-in current monitoring function that enables real-time feedback. This allows external devices such as CPUs and microcontrollers to track the load current and adjust control signals dynamically, optimising motor performance under varying conditions.

In addition, the current monitoring can be used to detect torque changes and react accordingly, for example, when an endpoint is reached. The result is enhanced energy efficiency with precise motor operation and fewer external components, meeting the growing demand for smarter, more adaptable motor control in consumer and industrial equipment.

Among other error detection features, the drivers include overcurrent detection (ISD), which shuts down the output stage if the motor current exceeds a predefined limit. A fault signal indicates this abnormally high current in the motor coils and can also help to detect issues during operation, supporting predictive maintenance.

With an operational motor power supply range spanning 4.5V to 44V, the drivers are suited for an extensive array of applications, from battery-powered devices to equipment using commercial power sources. Their ultra-low current consumption in sleep mode, capped at 1μA, further enhances energy savings, making them suitable for battery-operated solutions like cordless cleaners.

In addition to motor control, including a half-bridge independent control mode unlocks a number of other opportunities, enabling the use of these drivers in devices such as smart meters. This versatility makes the TB67H453FNG and TB67H453FTG suitable for developers seeking a single, adaptable solution for multiple design requirements.

The TB67H453FNG is housed in an HTSSOP package measuring 5.0×6.4mm, while the TB67H453FTG is housed in a VQFN package measuring 3.0×3.0mm.

Both packages come with an exposed thermal pad for enhanced thermal performance and reliability.