Using proprietary packaging and miniaturisation technologies and based on the NXP 88W9098 combo chipset, the ultra-small dual-band module supports IEEE 802.11a/b/g/n/ac/ax 2×2 multi-user, multiple-input, multiple-output (MU-MIMO) and Bluetooth 5.3 Low Energy (LE).
The Wi-Fi section of the module supports connectivity up to 1.4x faster than conventional Wi-Fi compatible devices, offering data rates of up to 1200 Mbps. This section also supports the PCIe 3.0 interface with optional support for SDIO 3.0.
The Bluetooth 5.3 LE section supports speeds of up to 2 Mbps with a high-speed 4-wire UART interface, optional support for SDIO, and PCM for audio data.
The Type 1XL module employs sophisticated and enhanced hardware mechanisms and algorithms to optimise Wi-Fi and Bluetooth coexistence for maximum performance.
The module size is 19.1 mm (L) x 16.5 mm (W) x 2.1 mm (H), facilitating integration into size- and power-sensitive electronic devices for IoT, smart home, audio/video/voice, smart TV, and gateway applications. It will have a reference antennae design for FCC/IC certifications and CE conducted test to provide a lower development cost and faster time to market.
The Type 1XL module is now in mass production.
