Soft-PGS has been developed as a thermal interface material (TIM), with high thermal conductivity of 28W/m K and compressibility of 40%.
Soft-PGS graphite sheet consists of a 2D carbon matrix only 200µm thick, which effectively disperses and transfers heat along X, Y and Z axes, protecting sensitive electronics like server units, IGBT modules or common inventors from damage.
Also on show is the Nano Silica Balloon Insulation Sheet (NASBIS), which according to Panasonic is the “thinnest insulation solution currently available on the market”. The NASBIS high-performance thermal insulation sheet comes with a thickness of 50μm, 100μm, 500μm, or 1000μm and an ultra-low thermal conductivity of 0.018 to 0.024W/mK. This very low thermal conductivity is achieved thanks to a pore diameter which is smaller than mean free path of air (68nm). In battery packs NASBIS can contribute safety-design with its insulation properties. It reduces the possibility of a rise in temperature in the adjacent cell. Additionally, NASBIS contributes in downsizing and weight saving compared to other insulation material.
Further passive components on display from Panasonic include a variety of the company’s latest capacitor, inductors and resistors technology. Featured conductive polymer capacitors from Panasonic’s broad products portfolio include SP-Cap (polymer-aluminium), POSCAP (tantalum-polymer), OS-Con (polymer-aluminium) and Hybrid (polymer-lytic), which are said to be unique to Panasonic and designed to enable high power applications to achieve “optimum performance” through their low ESR, high ripple current and long life characteristics.
