The TPS546C23 power converter is claimed to integrate high- and low-side MOSFETs into a single-pad, stacked die, QFN package that is significantly denser than competitive devices. Designers can supposedly stack two converters in parallel to drive loads up to 70A for processors in space-constrained and power-dense applications, including wired and wireless communications, enterprise and cloud computing, and data storage systems.
The power converter is said to be 44% denser than competitive devices. It features 0.5% reference-voltage accuracy over temperature and full differential remote-voltage sensing to meet the voltage accuracy requirements of deep sub-micron processors.
The company also offers the TPS546C20A PMBus converter which supports pin-strapping for the output voltage and soft-start time.
Additional features: |
