Power to board solutions deliver higher current while saving space and weight

Amphenol's RADSOK Power to Board product line is said to deliver high current and single-point connections to PCBs to achieve greater system integration. The RADSOK Power to Board product line has a current carrying capability of up to 200A and thanks to its hyperbolic lamella socket contact construction, delivers higher current at lower temperatures than traditional contact systems.

RADSERTs are versatile, low profile, single point high current contacts that can be applied to a PCB or busbar. Featuring enhanced lead in and mis-alignment tolerance; they have current carrying capability up to 120A, are suitable for blindmate applications and are available in press-fit or solder version termination styles.

PowerBlok connectors feature a robust mechanical design with current rating up to 200A, RADSOK contacts and a small footprint; they are suitable for applications where space and weight are critical. Generous mis-alignment tolerance or 'float' handles blindmating situations. For high-speed backplane and midplane applications, PowerBlok has press fit compliant pin termination.

PGY is a family of orthogonal card edge connectors carrying up to 200A available in multiple sizes. Featuring a robust mechanical design, PGY card edge connectors are optimised to dissipate heat and deliver power to the PCB evenly, and are suitable for blindmate drawer applications.

PowerBlok WTB (Wire to Board) is a line of low profile wire to board connectors with a current rating up to 70A. Offered in vertical or horizontal mating planes as single-point contact terminals. Removable lock housing ensures mating to the board remains intact under harsh vibration conditions. Designed for pin through hole placement, they are supplied in tape and reel packaging.