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SemiQ 1200 V SiC MOSFETs deliver improved performance and reduce switching losses

SemiQ, a supplier of silicon carbide (SiC) solutions for ultra-efficient, high-performance, and high-voltage applications, has announced the QSiC 1200V MOSFET.

SemiQ 1200 V SiC MOSFETs deliver improved levels of performance

This is a third generation SiC device that shrinks the die size while improving switching speeds and efficiency. It is 20% smaller compared to the QSiC second generation SiC MOSFETs and has been developed to increase performance and cut switching losses in high-voltage applications.

SemiQ is targeting a diverse range of markets including EV‑charging stations, solar inverters, industrial power supplies and induction heating.

In addition to having a drain-to-source voltage (VDS) of 1200 V, the MOSFET reduces total switching losses to 1646 µJ and has a low on-resistance (RDS,on) of 16.1 mΩ. It is available as a bare die or in a four-pin TO-247 4L discrete package measuring 31.4 x 16.1 x 4.8 mm, which includes a reliable body diode and a driver-source pin for gate driving.

High-quality Known Good Die (KGD) testing has been conducted using UV tape and Tape & Reels, with all parts undergoing testing and verification at voltages exceeding 1400V, as well as being avalanche tested to 800 mJ.

Reliability has further been improved through the device’s 100% wafer-level gate oxide burn-in screening and 100% UIL testing of discrete packaged devices.

The device has been developed to have a low reverse recovery charge (QRR 470 nC) and lower capacitance, improving switching speed, switching losses, EMI and overall efficiency; to be easy to parallel; and with a longer creepage distance (9 mm), improving electrical insulation, voltage tolerance and reliability.

Ratings and electrical/thermal characteristics:

The QSiC 1200V MOSFETs has a continuous operational and storage temperature of -55C to 175C. It has a recommended operational gate-source voltage of -4/18 V, with a VGSmax of -8/22 V, and a power dissipation of 484 W (core and junction temperature 25C).

For static electrical characteristics, the device has a junction-to-case thermal resistance of 0.26C per watt (40C per watt junction to ambient). Its Zero gate voltage drain current is 100 nA, with a gate-source voltage current of 10 nA. Its AC characteristics include a turn-on delay time of 21 ns with rise time of 25 ns; its turn-off delay time is 65 ns with a fall time of 20 ns.

An increased range of resistances is available in bare-die and TO-247 4L packages with the following options:

  • 16 mΩ: GP3T016A120X / GP3T016A120H
  • 20 mΩ: GP3T020A120X / GP3T020A120H
  • 40 mΩ: GP3T040A120X / GP3T040A120H
  • 80 mΩ: GP3T080A120X / GP3T040A120H

Both the 16 mΩ (AS3T016A120X / AS3T016A120H) and 40 mΩ (AS3T040A120X / AS3T040A120H) options have been qualified for Automotive Applications Product Validation according to AEC-Q101.