These devices are intended for operation of single LV100 (Mitsubishi), XHP 2 (Infineon), HPnC (Fuji Electric) and equivalent semiconductor modules up to 2300 V blocking voltage for wind, energy storage and solar renewable energy installations.
This single-board driver enables active thermal management of inverter modules for improved system utilisation and reduces the bill-of-material count for increased reliability.
SCALE-iFlex XLT dual-channel gate drivers feature Negative Temperature Coefficient (NTC) data reporting – an isolated temperature measurement of the power module – which allows more accurate thermal management of converter systems. This enables system designers to optimise thermal design and obtain a 25 to 30 percent converter power increase from the same hardware.
The isolated NTC readout also reduces hardware complexity, eliminating multiple cables, connectors and additional isolation barrier crossing circuits.
The new gate drivers employ Power Integrations’ SCALE-2 chip set which minimises component count, while enhancing reliability. The gate driver board also protects the power switches in the event of a short-circuit.
