The BGAP520 PCIe NVMe family of products in M.2 Type 1620 BGA package (BGA NVMe) and small form-factor M.2 2230 single-sided module is intended in embedded systems where space constraints are a key design consideration.
The BGAP520 PCIe NVMe is the latest addition to SMART Modular’s portfolio of DuraFlash products to deliver durable and reliable Flash solutions to the industrial embedded market segment. DuraFlash branded products are built to high standards to withstand the harshest operating environments including extreme hot and cold temperatures, vibration, humidity, salty air, dust and exposure to sulfur dioxide.
The 1620 BGA NVMe and M.2 2230 PCIe NVMe modules address the need for soldered down and small form factor Flash storage in embedded systems. The products utilize a PCIe Gen 3 x4 interface and comply with the NVM Express v1.3 protocol standard. They are available in 3D NAND trilevel cell (TLC) in commercial temperature (0 °C to 70 °C) in 30GB to 240GB and pseudo single-level cell (pSLC) industrial temperature (-40 °C to 85 °C) in 20GB to 80GB versions.
Features for the SMART BGAP520 BGA NVMe and M.2 2230 products include:- Built with the latest controller and 3D NAND technology
- Supports PCIe Gen3 x 4
- Complies with NVMe v1.3 specifications
- BGA NVMe conforms to M.2 Type 1620 BGA package standard
- M.2 2230 module conforms to M.2 2230 S2-M module standard
- TLC version available in commercial temperature (0 °C to 70 °C) from 30GB to 240GB
- pSLC version available in industrial temperature (-40 °C to 85 °C) from 20GB to 80GB
