Housed in a compact package, the devices support PCIe 5.0, USB4 Ver.2, Thunderbolt 4 and DisplayPort 2.0 to connect and expand peripheral devices in applications such as PCs, server equipment, and mobile devices.
The two new products offer a -3dB bandwidth (differential) of 26.2GHz or 27.5GHz (typ.) at a maximum DC current in active mode of 150µA, ensuring high signal integrity levels. Toshiba has been able to achieve these high-performance characteristics by adopting the company’s original silicon-on-insulator complementary metal oxide semiconductor (SOI-CMOS) front-end process technology, called TaRFSOI.
The differential signal operating range is 0 to 2.0V for common mode voltage and a 0 to 1.8 Vpp for differential voltage swing, supporting a wide range of differential interface standards. In standby mode, the current consumption can be reduced to 10µA and below to conserve power consumption. The new devices can operate in ambient temperatures from -40ºC to +85ºC.
Housed in a XQFN16 2.4mm x 1.6mm package with a 0.4mm profile, the two devices address the needs of engineers looking for PCB real-estate miniaturisation. The TDS4B212MX has an optimised pinout to achieve high-frequency performance, while the TDS4A212MX’s pinout eases circuit board layout.
In addition to these two new high-performance devices for USB4, PCIe Gen 4 and Thunderbolt 4, Toshiba has also increased the range available from Farnell for other high-speed bus switches.
These would be suitable for USB 2.0, PCIe Gen1, also general purpose Input/Output (GPIO) in 5V and low voltage along with level shifting devices for I²C type interfaces. This gives design engineers a wide selection of bus switch and level shift options.
