The power switch products both comprise 8 channels and include high-side (TPD2015FN) and low-side (TPD2017FN) switches. Both devices benefit from Toshiba’s latest analogue device process (BiCD) that combines bipolar, CMOS, and DMOS technologies.
Both are housed in the small 0.65mm pitch SSOP30 package that measures just 9.7 ×7.6 ×1.2mm, offering a reduction of around 29% in mounting area and 20% in height over the SSOP24 package (13.0 × 8.0 ×1.5mm) that is used for current products such as the TPD2005F and TPD2007F, thereby reducing the size of designs.
With regard to the electrical performance, the on-resistance (RDS(ON)) of both devices is 0.4Ω – more than 50% less than that of Toshiba’s current products, significantly enhancing operating efficiency and enhancing thermal performance.
These rugged power switches are also able to operate at temperatures (Topr) from -40°C to +110°C with a junction temperature (Tj) as high as +150°C, ensuring their suitability for challenging industrial environments.
In addition, both products have built-in over current protection circuits and over temperature protection circuits, thereby ensuring the reliability of equipment they are used in.
