The lineup expands Renesas’ popular RX651 MCU group with a 64-pin (4.5mm x 4.5mm) BGA package that reduces footprint size by 59 percent compared to the 100-pin LGA, and a 64-pin (10mm x 10mm) LQFP that offers a 49 percent reduction versus the 100-pin LQFP.
The MCUs look to address advanced security needs for endpoint devices employing compact sensor and communication modules in industrial, network control, building automation, and smart metering systems operating at the IoT edge.
The RX651 MCUs integrate connectivity, Trusted Secure IP (TSIP), and trusted flash area protection that enable flash firmware updates in the field through secure network communications. The increase in endpoint devices operating at the edge has increased the need for secure over-the-air (OTA) firmware updates.
These RX651 devices support this reprogramming requirement with integrated TSIP, enhanced flash protection, and other technology advancements that offer a more secure and stable solution than other available solutions on the market.
Key features include:
Enables advanced IoT edge devices: The small 64-pin MCUs with enhanced security features are based on the high-performance RXv2 core and 40nm process that provide superior performance with a 520 CoreMark score at 120 MHz, and strong power efficiency with a 35 CoreMark/mA score as measured by EEMBC Benchmarks.
Easy in-the-field firmware updates: The integrated dual bank flash memory enables engineers to realise high root-of-trust levels through a combination of TSIP that protects the encryption key; encryption hardware accelerators including AES, 3DES, RSA, SHA, and TRNG; and code flash area protection to protect boot code from reprogramming. The dual bank flash function supports both BGO (Back Ground Operation) and SWAP, making it easier for manufacturers to execute in-the-field firmware updates securely and reliably.
Network connectivity features: Optimised for connected industrial environments, the RX651 MCUs are able to monitor the operating state of machinery from both inside and outside the factory, enabling data exchanges to change production instructions, and reprogram MCU memory to update equipment settings.
