The modular mezzanine interconnect is now able to offer clean signal integrity at data rates of 56 Gbps NRZ, making it suitable for high-density printed circuit board (PCB) applications with limited real estate. Applications include enterprise networking towers, telecommunication hubs and servers, industrial controllers, and medical and aerospace/defence high-data-rate scanning equipment.
Comprised of a vertical plug and vertical receptacle, it features a patented modular triad wafer design that enables customisable PCB routing in high-density applications. The system’s patented Solder Charge Technology PCB attachment method is capable of delivering very robust solder joints.
Designers can select from 85 Ohm, 100 Ohm, power triad and low-speed signal options to build a mezzanine solution and the connector design can also be blind mateable with rugged triads for multiple connectors.
The NeoScale triad wafer comprises of three pins per differential pair – two signal pins and one shield pin. Each triad is a standalone, shielded, 56-Gbps capable differential pair or an 8A power feed and can be optimised for signals supporting high-speed 85 Ohm or 100 Ohm differential pairs, high-speed single-ended transmissions, low-speed single-ended/control signals, and power pins.
Other mezzanine options offer high-speed differential pairs either at 90 to 92 Ohms to accommodate the 85 to 100 Ohm range, or they offer mezzanine options with only 85 or 100 Ohm options. The system allows designers to run 85 and 100 Ohm high-speed signals through one connector and, in addition, low-speed, single-ended signals (three signals per triad) and power (8A per triad) can be utilised.
The system’s honeycomb housing routes each triad to minimise crosstalk and effectively route out of the PCB in one or two layers, reducing the need for PCB real estate. In addition, ‘pillar of strength’ structures in the housing are able to protect the mating interface and flexible contacts to prevent terminal damage.
The NeoScale is available in 12.00 to 42.00mm stack heights, circuit sizes of 8 to 300 triad wafers in 2-, 4-, 6-, 8- and 10-row configurations and 85 or 100 Ohm impedance to provide optimal design flexibility. Customised versions are also available.
