Standard PCB design and manufacturing techniques have served the electronics industry well for decades, offering reliable and cost-effective solutions across a wide range of applications.
However, the rapid miniaturisation of electronic components, especially driven by the growth of IoT (Internet of Things) applications, is reshaping the design landscape. Engineers now face the challenge that critical components — previously available in standard packages — are increasingly offered only in small packages with extremely fine pin pitches.
This transition to smaller, more integrated electronics forces even experienced designers to rethink their PCB layout strategies. HDI (High-Density Interconnect) technology and microvias are no longer advanced options — they have become a necessity to meet the space, performance, and integration demands of modern IoT devices.
The challenges designers must now tackle include:
- Tighter pin pitches: micro-BGAs and Chip Scale Packages (CSP) require narrower tracks, smaller clearances, and advanced features like microvias for reliable interconnections.
- Higher layer counts: Increased density often demands additional PCB layers to manage complex routing.
- Signal integrity and manufacturing reliability: Careful design planning is critical to maintain signal quality and production robustness, especially for IoT applications where reliability and size are paramount.
Eurocircuits' HDI pool service is engineered to make the transition to HDI technology accessible and cost-effective — perfect for prototypes, small batches, and compact IoT-ready devices. By pooling multiple customer designs on a single panel, Eurocircuits optimises costs without sacrificing quality.
Key features of the HDI pool include:
- 0.1 mm diameter microvias between layers L1-L2 and L2-L3 (or L8-L7 and L7-L6), staggered for mechanical strength.
- Standardised 6 and 8-layer stackups including two microvia layers — ideal for routing micro-BGAs with pitches down to 0.4 mm without excessive cost increase.
- Instant online quotations and fast delivery in just 10 working days.
- European manufacturing ensures sustainability, reliability, and full traceability.
Typical uses for Eurocircuits’ HDI pool include:
- Integration of micro-BGAs in space-constrained IoT devices.
- Minimised via stubs for reliable high-speed signal transmission.
- Thermal decoupling of individual QFN components for enhanced performance and durability.
The manufaturing and assembly is carried out exclusively in Eurocircuits' own European facilities, ensuring consistent quality and supporting a sustainable supply chain. Eurocircuits proudly stands by its mission: Right First Time for Manufacturing, Engineers’ best friend, and Specialist in low volume PCB manufacturing and assembly.
Summary:
As miniaturisation and the demand for IoT-ready devices reshape electronics design, HDI and microvia PCBs have become essential. Eurocircuits' HDI pool service offers engineers a cost-effective, sustainable solution for high-density, high-performance designs — empowering the future of compact electronics.
For more information:
Eurocircuits HDI pool bare board and assembly service
